Method of manufacturing a sealing cap for an integrated circuit carrying substrate

ABSTRACT

A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate. 
     Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances.



